Product Overview
Electroless Plating Chemicals (ENIG/ENEPIG) used for Semiconductor Industry
Our electroless plating chemicals used for semiconductor industry deliver critical solutions across various application scenarios and ensure seamless compatibility across wafer-level and chip-level packaging, meeting the diverse needs of our customers with precision and reliability.
1.Wafer-level Packaging
• Power Device
Our ENIG/ENEPIG plating chemicals are widely used in metallization processes for power devices, including automotive-grade chips such as SiC MOSFET, FRD, and IGBT. Our products enhance power chips’ performance with superior high-voltage resistance, high-temperature endurance, and oxidation resistance, significantly improving the devices’ electrical reliability and environmental adaptability.
• CIS Packaging
Our electroless plating chemicals offer excellent solderability and metal adhesion, meeting the stringent standards of high-density integration, high performance consistency, and exceptional operating stability of end electronic devices.
2.Chip-level Packaging
Our ENIG/ENEPIG chemicals are also applied in ceramic, glass and IC substrates, providing outstanding adhesion, conductivity, oxidation resistance, and dielectric compatibility, ensuring the long-term stable operation of critical modules under challenging conditions such as high temperatures, intense vibrations, and high-frequency interference.
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